| 品牌 | 3PEAK(思瑞浦) | ADI(亞德諾)/MAXIM(美信) | ALLEGRO(美國埃戈羅) | BL(上海貝嶺) | BORN(伯恩半導體) | CJ(江蘇長電/長晶) | Corebai(芯佰微) | DIODES(美臺) | Gcore(揚州國芯) | GN(旌芯半導體) | GR(國睿) | HGC(深圳漢芯) | HGSEMI(華冠) | HTC | HTCSEMI(海天芯) | HX(恒佳興) | HXY MOSFET(華軒陽電子) | I-CORE(中微愛芯) | IDCHIP(英銳芯) | IKSEMICON | JSMSEMI(杰盛微) | KEC | KTP(科泰普) | LANKE(蘭科) | LRC(樂山無線電) | LX(靈星芯微) | MICROCHIP(美國微芯) | Mixic(中科芯億達) | MSKSEMI(美森科) | NEC(日電電子) | NTE ELECTRONICS, INC. | onsemi(安森美) | RICHTEK(立锜) | ROHM(羅姆) | SANKEN(三墾) | SILAN(士蘭微) | Silicore(芯谷) | Siproin(上海矽朋) | SKYWORKS | Slkor(薩科微) | ST(意法半導體) | Sungine(雙競集成) | TECH PUBLIC(臺舟) | TI(德州儀器) | TM(天微) | TOSHIBA(東芝) | TWGMC(臺灣迪嘉) | UMW(友臺半導體) | UTC(友順) | WD(維得) | XBLW(芯伯樂) | XINLUDA(信路達) | YW(友旺) | ZHHXDZ(海芯電子) | |
| 封裝/規格 | DFN-10(3x3) | DIP-14 | DIP-16 | DIP-18 | DIP-8 | MSOP-10-0.5mm | QFN-20 | QFN-20(4x4) | QFN-20-EP(4x4) | SIP-10 | SIP-12 | SIP-15 | SIP-8 | SOP-10 | SOP-14 | SOP-16 | SOP-16-208mil | SOP-18 | SOP-18-300mil | SOP-20 | SOP-20-300mil | SOP-8 | SOT-23-6 | SSOP-10-EP-150mil | SSOP-16 | SSOP-18 | SSOP-24 | SSOP-24-150mil | TO-252 | TSSOP-16 | TSSOP-20 | |
| 集電極電流(Ic) | 200mA | 250mA | 350mA | 500mA | 600mA | 1A | 1.5A | 1.75A | 2A | 3A | 4A | 5A | 6A | 8A | 10A | |
| 工作溫度 | -55℃~+125℃@(Ta) | -40℃~+85℃ | -40℃~+105℃ | -40℃~+85℃@(Ta) | -40℃~+70℃ | -30℃~+75℃ | -30℃~+105℃ | -20℃~85℃ | -20℃~+85℃@(Ta) | -20℃~+70℃ | -20℃~+85℃ | 0℃~+70℃ | 0℃~+85℃ | |
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