封裝/規格 | BGA-12 | BGA-6 | BGA-9 | DFN-10(3x3) | DFN-10(4x4) | DFN-12(1.5x2.4) | DFN-12(2x3) | DFN-12(3x4) | DFN-14(3x4) | DFN-18(3x5) | DFN-6(1.8x2) | DFN-6(2x2) | DFN-6(3x3) | DFN-8 | DFN-8(2.4x2.4) | DFN-8(2.5x2.7) | DFN-8(2x2) | DFN-8(2x2.2) | DFN-8(3x3) | DIP-14 | DIP-8 | eTSSOP-38 | LFCSP-16(4x4) | MSOP-10 | MSOP-10-EP | MSOP-12 | MSOP-12-EP | MSOP-16-EP | MSOP-8 | QFN-10(1.4x1.8) | QFN-12(4x4) | QFN-12-EP(4x4) | QFN-16-EP(3x3) | QFN-20-EP(4x4) | QFN-24-EP(3x5) | QFN-28-EP(4x5) | QFN-32(5x5) | QFN-32-EP(5x5) | QFN-6(2x2) | SOP-14 | SOP-14-5mm | SOP-16 | SOP-16-300mil | SOP-8 | SOP-8-208mil | SOP-8-6.8mm | SOT-23-5 | SOT-23-6 | SOT-363 | SSOP-14-175mil | SSOP-16-150mil | SSOP-20-150mil | SSOP-8-175mil | TSSOP-14 | TSSOP-14-EP | TSSOP-16 | TSSOP-20 | TSSOP-20-EP | TSSOP-24-EP | TSSOP-38-EP | TSSOP-8 | VQFN20PV3535 | WLCSP-15 | WLCSP-20 | WLCSP-8 | |
品牌 | ABLIC(艾普凌科) | ADI(亞德諾) | ADI(亞德諾)/MAXIM(美信) | ALLEGRO(美國埃戈羅) | AWINIC(艾為) | Catalyst Semiconductor Inc. | CHIPLON(啟瓏) | chipown(芯朋微電子) | FITIPOWER(天鈺) | Full-Way(四方杰芯) | HARRIS(哈利斯) | HEERMICR(赫爾半導體) | Helix | HEXIN(禾芯微) | HGSEMI(華冠) | HOLTEK(合泰/盛群) | HTC | I-CORE(中微愛芯) | LOWPOWER(微源半導體) | LX(靈星芯微) | MaxLinear(邁凌) | MICROCHIP(美國微芯) | MICRONE(南京微盟) | MPS(芯源) | Nisshinbo | onsemi(安森美) | RENESAS(瑞薩)/IDT | ROHM(羅姆) | SGMICRO(圣邦微) | SHOUDING(首鼎半導體) | Sillumin(數明半導體) | SIPEX | ST(意法半導體) | TI(德州儀器) | Tokmas(托克馬斯) | TOPPOWER(南京拓微) | TOREX(特瑞仕) | WILLSEMI(韋爾) | XBLW(芯伯樂) | XDS(芯鼎盛) | XINLUDA(信路達) | ZHHXDZ(海芯電子) | 明達微 | |